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Plasma-processing-induced Damage of Thin Dielectric Films
He Ren
Plasma-processing-induced Damage of Thin Dielectric Films
He Ren
In semiconductor industry, material property degradation due to process is a critical factor that limits the device performance. Process-induced damage on a variety of dielectric materials is discussed and measured. Results from various metrologies are packaged and correlated into systematic theory. Charge-induced, chemical, and physical damage source in plasma process environment is identified and optimized. Two sample types of dielectrics are investigated: high-k dielectrics used in device technology and low-k dielectrics as observed in interconnect technology.
Media | Books Paperback Book (Book with soft cover and glued back) |
Released | November 30, 2012 |
ISBN13 | 9783843387583 |
Publishers | LAP LAMBERT Academic Publishing |
Pages | 188 |
Dimensions | 150 × 11 × 226 mm · 281 g |
Language | English |
See all of He Ren ( e.g. Paperback Book )