Benefiting from Thermal and Mechanical Simulation in Micro-electronics - G Q Zhang - Books - Springer-Verlag New York Inc. - 9781441948731 - December 3, 2010
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Benefiting from Thermal and Mechanical Simulation in Micro-electronics Softcover Reprint of the Original 1st Ed. 2000 edition

G Q Zhang

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Benefiting from Thermal and Mechanical Simulation in Micro-electronics Softcover Reprint of the Original 1st Ed. 2000 edition

192 pages, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released December 3, 2010
ISBN13 9781441948731
Publishers Springer-Verlag New York Inc.
Pages 192
Dimensions 156 × 234 × 11 mm   ·   299 g
Editor Ernst, L.j.
Editor Leger, O.de Saint
Editor Zhang, G.q

See all of G Q Zhang ( e.g. Paperback Book )