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Elements of Electromigration: Electromigration in 3D IC technology
Tu, King-Ning (City University of Hong Kong)
Elements of Electromigration: Electromigration in 3D IC technology
Tu, King-Ning (City University of Hong Kong)
In this invaluable resource for graduate students and practicing professionals, Tu and Liu provide a comprehensive account of electromigration and give a practical guide on how to manage its effects in microelectronic devices, especially newer devices that make use of 3D architectures.
184 pages, 5 Tables, black and white; 27 Line drawings, black and white; 38 Halftones, black and whi
Media | Books Hardcover Book (Book with hard spine and cover) |
Released | January 19, 2024 |
ISBN13 | 9781032470276 |
Publishers | Taylor & Francis Ltd |
Pages | 132 |
Dimensions | 421 g |