Rapid Thermal Processing for Future Semiconductor Devices - Fukuda, H. (Muroran Institute of Technology, Department of Electrical and Electronic Engineering, Mizumoto-cho, Muroran, Hokkaido, Japan) - Books - Elsevier Science & Technology - 9780444513397 - April 2, 2003
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Rapid Thermal Processing for Future Semiconductor Devices

Fukuda, H. (Muroran Institute of Technology, Department of Electrical and Electronic Engineering, Mizumoto-cho, Muroran, Hokkaido, Japan)

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Rapid Thermal Processing for Future Semiconductor Devices

A collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. It covers the following areas such as advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe and hetero-structure.

160 pages

Media Books     Paperback Book   (Book with soft cover and glued back)
Released April 2, 2003
ISBN13 9780444513397
Publishers Elsevier Science & Technology
Pages 160
Dimensions 172 × 243 × 17 mm   ·   310 g

See all of Fukuda, H. (Muroran Institute of Technology, Department of Electrical and Electronic Engineering, Mizumoto-cho, Muroran, Hokkaido, Japan) ( e.g. Paperback Book )