System on Package - Rao Tummala - Books - McGraw-Hill Education - Europe - 9780071459068 - June 16, 2008
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System on Package Ed edition

Rao Tummala

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System on Package Ed edition

"System-on-Package" (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. This book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this packaging technology can be used to solve pressing electronics design challenges.


785 pages, Illustrations

Media Books     Hardcover Book   (Book with hard spine and cover)
Released June 16, 2008
ISBN13 9780071459068
Publishers McGraw-Hill Education - Europe
Pages 785
Dimensions 193 × 241 × 35 mm   ·   1.62 kg

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