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Manufacturing Challenges in Electronic Packaging Softcover reprint of the original 1st ed. 1998 edition
Y C Lee
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Manufacturing Challenges in Electronic Packaging Softcover reprint of the original 1st ed. 1998 edition
Y C Lee
About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements.
261 pages, biography
| Media | Books Paperback Book (Book with soft cover and glued back) |
| Released | September 25, 2012 |
| ISBN13 | 9781461376590 |
| Publishers | Springer-Verlag New York Inc. |
| Pages | 261 |
| Dimensions | 155 × 235 × 14 mm · 390 g |
| Editor | Chen, W.T. |
| Editor | Lee, Y.C. |
See all of Y C Lee ( e.g. Hardcover Book and Paperback Book )